PACKAGE

HGC focuses on UV, lighting, backlight, display and other fields, and provides high-end customized packaging and testing solutions and supporting production capacity for the global market.

Automotive-grade Series

Automotive-grade Series

Flip chip, small size substrate package

Long life, low light decay, high reliability

High optical output power

Easy to design, suitable for multiple applications

UV Series

All-inorganic UVC3535 All-inorganic UVC3535
All-inorganic UVC3535

All-inorganic UVC3535

UVC6565 Hemisphere UVC6565 Hemisphere
UVC6565 Hemisphere

UVC6565 Hemisphere

High-power high-end products, using all-inorganic packaging technology, strong air tightness, high reliability, and low light decay

High-power products, light gathering type small-angle package, more concentrated radiation area

Large light angle and wide radiation area

Can be reflowed at high temperature, with high reliability and low light decay

Low thermal resistance, can carry high current density

Through REACH, RoHS and other environmental certification

Through REACH, RoHS and other environmental certification

Applicable Scenarios:

sterilization (especially dynamic water sterilization, air sterilization), medical phototherapy, optical sensors, biological analysis/detection

Applicable Scenarios:

general lighting, automotive lighting, Lens LB and other traditional backlight applications

All-inorganic UVC3535 All-inorganic UVC3535
All-inorganic UVC3535

All-inorganic UVC3535

High-power high-end products, using all-inorganic packaging technology, strong air tightness, high reliability, and low light decay

Large light angle and wide radiation area

Low thermal resistance, can carry high current density

Through REACH, RoHS and other environmental certification

Applicable Scenarios:

sterilization (especially dynamic water sterilization, air sterilization), medical phototherapy, optical sensors, biological analysis/detection

UVC6565 Hemisphere UVC6565 Hemisphere
UVC6565 Hemisphere

UVC6565 Hemisphere

High-power products, light gathering type small-angle package, more concentrated radiation area

Can be reflowed at high temperature, with high reliability and low light decay

Through REACH, RoHS and other environmental certification

Applicable Scenarios:

general lighting, automotive lighting, Lens LB and other traditional backlight applications

Backlight Series

Backlight Series

Side emit light, small size bracket package, small size

Provide effective solutions for optical design to meet complexity requirements

Product diversification, providing more flexible color design for backlight design

Application Scenarios: backlights for mobile phones, pads and laptops

Custom Series

sunlike 2835 Series

sunlike 2835 Series

Plant Light Series

Plant Light Series

High light Efficiency Series

High light Efficiency Series

Use non-blue-ray chip package

Using phosphors to excite blue light chips to convert monochromatic light

High reliability and high light efficiency

High color rendering index Ra≥98, R1-R15 are all greater than 90, making the color more realistic

Spectrum 445+495 double wave-crest

Divided color gamut according to ANSI standard, uniform light color

The spectrum is soft and continuous, approaching natural light

High brightness and low cost

Support reflow soldering, ROSH environmental certification

The spectrum is soft and continuous, approaching natural light

Application Scenario: Educational Lighting

Application Scenario: Plant Lighting

Application Scenarios: Plant Lighting & Outdoor Lighting

sunlike 2835 Series

sunlike 2835 Series

Use non-blue-ray chip package

High color rendering index Ra≥98, R1-R15 are all greater than 90, making the color more realistic

The spectrum is soft and continuous, approaching natural light

Application Scenario: Educational Lighting

Plant Light Series

Plant Light Series

Using phosphors to excite blue light chips to convert monochromatic light

Spectrum 445+495 double wave-crest

High brightness and low cost

Application Scenario: Plant Lighting

High light Efficiency Series

High light Efficiency Series

High reliability and high light efficiency

Divided color gamut according to ANSI standard, uniform light color

Support reflow soldering, ROSH environmental certification

CSP/ACSP Series

CSP1313

CSP1313

Chip size package, small size, high optical density

Low thermal resistance, can withstand higher current, and achieve high power

Adopt automotive-grade flip-chip to achieve high power, high brightness and high reliability

Can be reflowed at high temperature for high reliability

Five sides emit light, large light-emitting angle

Applicable Scenarios: general lighting, automotive lighting, Lens LB and other traditional backlight applications

Chip size package, small size, high optical density,

Low thermal resistance

Double pad carrier is used at the bottom to improve SMT yield

Can be reflowed at high temperature for high reliability

Five sides emit light, large light-emitting angle

Applicable Scenarios: general lighting, automotive lighting, digital tube, Mini backlight applications

ACSP0510

ACSP0510