UV Light Source

Healthy Life Starts from the Chip

Inorganic high-power series

Inorganic packaging process, AR film design for various UV wavelengths, light output efficiency >97%, organic content 0%, reliable lifespan exceeding 30,000 hours, used in disinfection, medical, and high-power catalysis fields.

Picture Model Size(mm) Substrate Test/Max IF(mA) VF(V) Spectral radiant flux Φe(mW) Peak Wavelength(nm) Radiation Degree(Deg) Application
HGC-L68FU29N8H 6.8*6.8*1.7 Ceramics 700/700 10.0~14.0 200~400 290~300 120 Industrial healthcare
HGC-L68FU34N8H 6.8*6.8*1.7 Ceramics 700/700 8.0~13.0 200~400 335~345 120 Industrial solidification

Inorganic series

Inorganic packaging process, high light output efficiency, high reliability, organic content 0%, reliable lifespan exceeding 30,000 hours, used in high-power disinfection applications.

Picture Model Size(mm) Substrate Test/Max IF(mA) VF(V) Spectral radiant flux Φe(mW) Peak Wavelength(nm) Radiation Degree(Deg) Application
HGC-L35BU27N4F 3.5*3.5*1.7 Ceramics 500/500 5.0~7.0 50~100 265~285 120 Industrial healthcare

Semi inorganic series

Air-tight semi-inorganic packaging process, gold-tin eutectic soldering process. Its characteristics include a stable and reliable structure, wide market coverage, and large-scale manufacturing capabilities.

Picture Model Size(mm) Substrate Test/Max IF(mA) VF(V) Spectral radiant flux Φe(mW) Peak Wavelength(nm) Radiation Degree(Deg) Application
HGC-L35BU27N1A 3.5*3.5*1.5 Ceramics 30/40 5.0~7.0 2.5~8.0 265~285 120 Industrial healthcare
HGC-L35BU27N4C 3.5*3.5*1.7 Ceramics 100/120 5.0~7.0 10~25 265~285 120 Industrial healthcare